Taipei: Taiwan Semiconductor Manufacturing Co. (TSMC) on Saturday remained tight-lipped over a media report indicating the contract chipmaker plans to build an additional four advanced IC assembly plants in Taiwan. The world’s largest contract chipmaker declined to comment, stating that any information on new facility construction will primarily come from public announcements.

According to Focus Taiwan, a report published by the Liberty Times earlier on Saturday suggested that while TSMC is expanding its high-end chip production capacity, the chipmaker is also investing in the construction of advanced IC assembly plants. The report, which cited unnamed sources from TSMC’s supply chain, claimed that the company will build two IC assembly plants in the Chiayi Science Park and another two in the Southern Taiwan Science Park this year.

The report further mentioned that Cliff Hou, TSMC’s senior vice president, deputy co-chief operating officer, and chief information security officer, is scheduled to announce the new investment next week. According to the report, TSMC is building two advanced IC assembly plants in Chiayi as part of a broader strategy to leverage Chiayi as a base for sophisticated IC assembly services.

TSMC is also investing in high-end chip production technologies in Hsinchu, Kaohsiung, and the Southern Taiwan Science Park. In the fourth quarter of 2025, TSMC commenced mass production of the 2-nanometer process in Hsinchu and Kaohsiung. At an investor conference held on Thursday, TSMC Chairman and CEO C.C. Wei stated that the company plans to build several new 2nm process fabs in Hsinchu and Kaohsiung and will continue to invest more in advanced chip technologies and IC packaging services over the next few years.

TSMC has planned for capital expenditure ranging from US$52.0 billion to US$56.0 billion in 2026, marking an increase of 27-37 percent from 2025. According to TSMC, 60-80 percent of the 2026 capex will be directed toward advanced process development, 10 percent to specialty processes, and 10-20 percent to high-end IC assembly, testing, photomasking, and other items.