Intel CEO Pat Gelsinger has welcomed Taiwan Semiconductor Manufacturing Co.’s (TSMC) investment in Arizona, lauding the value of a globally diversified supply chain to help the semiconductor sector be more resilient.

“We are pleased to welcome our friends at TSMC as they celebrate their Arizona tool-in ceremony and show their support for US manufacturing,” Gelsinger said on Twitter.

“We’re strong believers in the value of globally diversified and resilient semiconductor manufacturing operations,” said Gelsinger, who arrived in Taiwan for a visit on Wednesday.

Gelsinger touted Arizona as a “great place” to make semiconductors, with excellent engineering talent.

Since Intel began operations in Arizona in 1980, when it established its Chandler facility, Intel has “led the building of the local ecosystem and talent base” in the state, Gelsinger said.

“As @Intel, TSMC and others continue to invest here, Arizonans are a critical part of the future of the industry!”

TSMC, the world’s largest contract chipmaker, held a tool-in ceremony Tuesday to mark the installation of the first batch of equipment at its new US$12 billion fab in the northern Phoenix area.

The fab will use the 4-nanometer production process, but the company also announced it would increase its total investment in Arizona to US$40 billion to build a second fab using the more advanced 3-nm process that could begin operations in 2026.

U.S. President Joe Biden attended and spoke at the ceremony and toured TSMC’s new fab site that, once completed, is scheduled to begin mass production of 4-nm chips in 2024.

After arriving in Taiwan on Wednesday morning, Gelsinger attended the Intel® Sustainability Taiwan Day held in Taipei, an event that features speeches, discussions, and trade shows focused on sustainability.

Source: Focus Taiwan News Channel