With the high efficiency and low power consumption of terminal electronic products, the products using advanced process technology are increasing. When the process technology is developed to below 10 nm, the wafer test interface is relatively important for the IC yield. It also needs to be upgraded. In particular, the 10nm advanced process is more demanding than the 20nm test. Therefore, in response to the wafer industry entering the 10nm advanced process mass production, China Precision Measuring Company develops the Ultra-Fine Pitch high speed. The multi-die test interface technology provides the best solution for customers with advanced process processes up to 14/16 nm and successfully completes IC wafer testing. At present, it is the leading supplier of TSMC's 10nm process test.
The Bureau promotes the industrial upgrading and innovation platform counseling program, encourages enterprises to invest in R and D and innovation activities through research and development subsidies, develops products or services with market competitiveness, enhances independent research and development of energy technologies, and encourages manufacturers to master key technologies/products to construct complete supply. Chain system. In the 105 years, China Precision Testing Co., Ltd. applied for the Ultra-Fine Pitch high-speed multi-die test interface development plan, which was approved by the Industrial Bureau's industrial upgrading and innovation platform.
Ultra-Fine Pitch high-speed multi-die test interface technology, the development of Ultra-Fine Pitch test interface (Interposer) with organic materials and combined semiconductor process technology, is an important adapter plate in wafer testing, leading the industry's first three The process technology breaks through the technical bottleneck of organic materials limited by temperature to achieve the research and development of micro-pitch test interface. In addition to the breakthrough of process technology, it also conducts in-depth research on the electrical part to develop high-frequency, high-speed, low-power impedance. The design technology, combined with lower-loss materials and parts, provides higher signal transmission quality and technology, meeting the trend of semiconductors below 10nm advanced process and high-performance mobile communication chip design.
China Precision Testing Co., Ltd. has been engaged in the field of semiconductor testing services for many years and has been focusing on providing the panel services required for semiconductor industry testing. The main products are to provide highly customized wafer test boards and IC test boards, which provide a small amount of pitch for the industry. Manufacturers with fine lines, high numbers and high aspect ratios have key and unique technologies in this field. In April, 106, they won the 4th potential backbone enterprise. The new operations headquarters was launched in July 2006 and is expected to be completed in the third quarter of 108.
Source: Industrial Development Bureau, Ministry of Economic Affairs