Taipei: Taiwan Semiconductor Manufacturing Co. (TSMC) will construct three additional advanced packaging facilities in Phase II of the Chiayi Science Park (CSP), announced National Science and Technology Council (NSTC) head Wu Cheng-wen on Sunday.

According to Focus Taiwan, Wu made the announcement during the groundbreaking ceremony for CSP Phase II. The site, spanning approximately 90 hectares, is set to become an advanced packaging industry cluster spearheaded by TSMC. The first phase, with two advanced packaging facilities, commenced mass production in June. Upon full operation of both phases, the facilities within the Chiayi Science Park are anticipated to produce an annual output exceeding NT$300 billion (US$9.35 billion).

Wu highlighted that the expansion in Phase II aims to address the rising global demand for high-performance computing (HPC) chips and advanced packaging technologies.

He further mentioned that the Chiayi Science Park will integrate with other Southern Taiwan Science Park branches located in Tainan, Kaohsiung, and Pingtung County, as well as the Central Taiwan Science Park and Hsinchu Science Park. This collaboration is intended to create the world's most comprehensive artificial intelligence and semiconductor industry corridor.